Heat Sink Compound

Product Description

Description: This is a 5g syringe of white heatsink compound (aka thermal grease, thermal paste, thermal goo). Use this whenever you're connecting a component to a heatsink, it'll really help to dissipate even more potentially damaging heat.



This compound is composed of 50% silicone, 20% carbon, and 30% metal oxide. It has a thermal conductivity of 1.172 W/(mK), which should be plenty for voltage regulators, MOSFETs, motor drivers, audio amplifiers, etc.



Features:

• 
  Color: White


• 
  Thermal Conductivity: 1.172 W/(mK)


• 
  Thermal Impedance: 0.195 -in^2/W


• 
  Specific Gravity: 2.3 @25°C


• 
  Evaporation: 0.001% - 24 hrs @150°C


• 
  Bleed: 0.05% - 24 hrs @150°C


• 
  Moment Beared Temperature: -50-240°C


• 
  Operation Temperature: -30-180°C